The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Apr. 10, 2009
Applicants:

Dong-june Hwang, Incheon, KR;

Jae-bong Lim, Gyeonggi-do, KR;

Seung-do Leem, Gyeonggi-do, KR;

Tae-young Kim, Gyeonggi-do, KR;

Sung-su Bae, Gyeonggi-do, KR;

Inventors:

Dong-June Hwang, Incheon, KR;

Jae-Bong Lim, Gyeonggi-do, KR;

Seung-Do Leem, Gyeonggi-do, KR;

Tae-Young Kim, Gyeonggi-do, KR;

Sung-su Bae, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 69/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method of prepairing a heat-resistant polyamide by carrying out condensation polymerization with a monomer mixture including a diester compound and a diamine compound. The present invention provides an economical method of prepairing a heat-resistant polyamide in that a monomer, a raw material, is simply and chiefly prepared, and the polymerizing reaction time is short because it does not need solvent separately.


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