The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Aug. 21, 2008
Applicants:
Shingo Nakamura, Settsu, JP;
Takehiko Kezuka, Settsu, JP;
Inventors:
Shingo Nakamura, Settsu, JP;
Takehiko Kezuka, Settsu, JP;
Assignee:
Daikin Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 7/32 (2006.01); H01L 21/02 (2006.01); C11D 11/00 (2006.01); C11D 7/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02068 (2013.01); H01L 21/02063 (2013.01); C11D 7/3281 (2013.01); C11D 11/0047 (2013.01); C11D 7/34 (2013.01);
Abstract
A residue-removing solution for removing residues present on semiconductor substrates after dry etching and/or ashing, the residue-removing solution comprising a Cu surface protective agent including: at least one compound selected from compounds (1), (2) and (3) each having as a basic skeleton a five-membered or six-membered heteratomic structure as defined herein; a compound capable of forming a complex or chelate with Cu (copper); and water. Further, the residue-removing solution has a pH of 4 to 9.