The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Mar. 16, 2012
Naoko Yamaguchi, Kanagawa, JP;
Kazumasa Tanida, Oita, JP;
Hideo Numata, Oita, JP;
Satoshi Hongo, Oita, JP;
Kenji Takahashi, Ibaraki, JP;
Naoko Yamaguchi, Kanagawa, JP;
Kazumasa Tanida, Oita, JP;
Hideo Numata, Oita, JP;
Satoshi Hongo, Oita, JP;
Kenji Takahashi, Ibaraki, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus includes a stage, a substrate supporter, first and second pushers, and a controller. The stage is configured to support outer periphery portions of the first semiconductor substrate from below. The substrate supporter is configured to hold the back of the second semiconductor substrate. The first and second pushers are configured to bring the first and second semiconductor substrates in contact. The controller is configured to form the bonding initiation point between the first and second semiconductor substrates.