The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Nov. 01, 2013
Applicant:

Micronas Gmbh, Freiburg, DE;

Inventors:

Tobias Kolleth, Freiburg, DE;

Pascal Stumpf, Horbourg-Wihr, FR;

Christian Joos, Ehrenkirchen, DE;

Assignee:

Micronas GmbH, Freiburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 2924/1815 (2013.01); H01L 23/16 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48091 (2013.01); H01L 24/48 (2013.01); H01L 2224/48247 (2013.01); H01L 23/3107 (2013.01);
Abstract

A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body.


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