The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Apr. 25, 2008
Applicants:

Robert Roelofs, Allen Park, MI (US);

Dan Bullard, Valparaiso, IN (US);

Mike Bilos, Chicago, IL (US);

Bryan Tullis, Royal Oak, MI (US);

Inventors:

Robert Roelofs, Allen Park, MI (US);

Dan Bullard, Valparaiso, IN (US);

Mike Bilos, Chicago, IL (US);

Bryan Tullis, Royal Oak, MI (US);

Assignee:

Material Sciences Corporation, Elk Grove Village, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
B32B 37/00 (2013.01); B32B 15/08 (2013.01); B32B 2250/40 (2013.01);
Abstract

The present invention provides a bimetal laminate structure and improved method for manufacturing the same. The method includes: applying a layer of adhesive to a metallic substrate; and laminating a decorative metallic sheet to the metallic substrate in such a manner that substantially all surface defects and all read through appearance along an outer surface of the decorative metallic sheet are eliminated. The resultant bimetal laminate includes a decorative metallic layer consisting of a first metallic material, and a metallic substrate consisting of a second metallic material that is different from the first metallic material. The metal substrate has a thickness that is greater than the thickness of the decorative metallic layer. An adhesive layer is disposed between, and spans substantially the entirety of the decorative metallic layer and metallic substrate to rigidly attach the same.


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