The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

May. 03, 2011
Applicants:

Yusuke Yasuda, Hitachi, JP;

Toshiaki Morita, Hitachi, JP;

Eiichi Ide, Hitachi, JP;

Hiroshi Hozoji, Hitachiota, JP;

Toshiaki Ishii, Hitachi, JP;

Inventors:

Yusuke Yasuda, Hitachi, JP;

Toshiaki Morita, Hitachi, JP;

Eiichi Ide, Hitachi, JP;

Hiroshi Hozoji, Hitachiota, JP;

Toshiaki Ishii, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/02 (2006.01); B32B 5/02 (2006.01); B32B 5/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.


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