The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Sep. 14, 2012
Rob Slakhorst, Almelo, NL;
Gerard Klaasse, Apeldoorn, NL;
Erik Hop, Apeldoorn, NL;
Arnout Van Den Bos, Deurningen, NL;
Wico Hopman, Enschede, NL;
Rob Slakhorst, Almelo, NL;
Gerard Klaasse, Apeldoorn, NL;
Erik Hop, Apeldoorn, NL;
Arnout van den Bos, Deurningen, NL;
Wico Hopman, Enschede, NL;
Sensata Technologies, Inc., Attleboro, MA (US);
Abstract
Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.