The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Aug. 03, 2011
Applicants:

Toshihiro Shimizu, Fujimi-machi, JP;

Jiro Kato, Suwa, JP;

Eiju Hirai, Okaya, JP;

Hiroshi Ito, Suwa, JP;

Inventors:

Toshihiro Shimizu, Fujimi-machi, JP;

Jiro Kato, Suwa, JP;

Eiju Hirai, Okaya, JP;

Hiroshi Ito, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/00 (2006.01); H01L 41/29 (2013.01); B41J 2/16 (2006.01); H01L 41/314 (2013.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
H01L 41/29 (2013.01); B41J 2/161 (2013.01); B41J 2/1628 (2013.01); B41J 2/1631 (2013.01); B41J 2002/14491 (2013.01); H01L 41/314 (2013.01);
Abstract

A manufacturing method of a piezoelectric element includes: forming a first conductive layer upon a substrate; forming a piezoelectric layer upon the first conductive layer; forming a second conductive layer upon the piezoelectric layer; forming a third conductive layer upon the second conductive layer; forming a first portion, a second portion, and an opening portion provided between the first portion and the second portion by patterning the third conductive layer; forming a resist layer that covers the opening portion and covers the edges of the first portion and the second portion that face the opening portion side; and forming a first conductive portion and a second conductive portion configured from the first portion and the second portion, and forming a third conductive portion configured from the second conductive layer, by dry-etching the second conductive layer using the first portion, the second portion, and the resist layer as a mask.


Find Patent Forward Citations

Loading…