The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Jan. 20, 2010
Applicants:

Takeshi Inoda, Daito, JP;

Ryusuke Horibe, Daito, JP;

Fuminori Tanaka, Daito, JP;

Tomio Ishida, Daito, JP;

Inventors:

Takeshi Inoda, Daito, JP;

Ryusuke Horibe, Daito, JP;

Fuminori Tanaka, Daito, JP;

Tomio Ishida, Daito, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 9/08 (2006.01); H04R 11/04 (2006.01); H04R 17/02 (2006.01); H04R 19/04 (2006.01); H04R 21/02 (2006.01); H04R 25/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01);
Abstract

Disclosed is a microphone unit comprising a film substrate (), electrically conductive layers () which are formed on both substrate surfaces of the film substrate (), and an electrical acoustic transducer unit () which is provided on the film substrate () and comprises a diaphragm capable of converting a sound pressure to an electrical signal. In the microphone unit, the linear expansion coefficient of the film substrate (), including the electrically conductive layers (), falls within the range of 0.8 to 2.5 times, inclusive, the linear expansion coefficient of the diaphragm.


Find Patent Forward Citations

Loading…