The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Mar. 12, 2009
Applicant:
Takahiro Hayashi, Fujisawa, JP;
Inventor:
Takahiro Hayashi, Fujisawa, JP;
Assignee:
Nippon Mektron, Ltd., , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); G01D 11/24 (2006.01); H05K 1/18 (2006.01); H05K 5/06 (2006.01); H05K 1/03 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H05K 1/0393 (2013.01); G01D 11/245 (2013.01); H05K 2203/1147 (2013.01); H05K 3/284 (2013.01); H05K 2201/10151 (2013.01); H05K 5/069 (2013.01);
Abstract
In order to provide excellent waterproofness at a low manufacturing cost to a seal structure comprising a housing to which a flexible wiring board () is inserted and a seal member () integrally formed on said flexible wiring board () for hermetically sealing a gap between said housing and said flexible wiring board (), a whole surface of a sensor member () arranged on at least one side of said flexible wiring board () is coated by same material as is used in said seal member (), at a time of integrally forming the seal member () on the flexible wiring board ().