The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Sep. 10, 2012
Applicants:

Hsien-ku Chen, Taoyuan County, TW;

Chia-jun Chang, Taipei, TW;

Ka-un Chan, Hsinchu County, TW;

Ying-hsi Lin, Hsin-Chu, TW;

Inventors:

Hsien-Ku Chen, Taoyuan County, TW;

Chia-Jun Chang, Taipei, TW;

Ka-Un Chan, Hsinchu County, TW;

Ying-Hsi Lin, Hsin-Chu, TW;

Assignee:

Realtek Semiconductor Corp., Science Park, HsinChu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03F 3/45 (2006.01);
U.S. Cl.
CPC ...
H03F 3/45 (2013.01);
Abstract

A signal amplifying circuit includes: an input stage circuit, arranged to receive an input signal; a first inductive device coupled between the input stage circuit and a first reference voltage; an output stage circuit arranged to generate an output signal according to the input signal; and a second inductive device coupled between the output stage circuit and a second reference voltage, wherein at least a part of a winding of the first inductive element is cross-coupled to at least a part of a winding of the second inductive element.


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