The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Jun. 19, 2013
Mitsubishi Electric Corporation, Tokyo, JP;
Yoichi Nogami, Tokyo, JP;
Yoshitsugu Yamamoto, Tokyo, JP;
Akira Inoue, Tokyo, JP;
Yoshinori Yokoyama, Tokyo, JP;
Jun Fujita, Tokyo, JP;
Kazuyo Endo, Tokyo, JP;
Shinnosuke Soda, Tokyo, JP;
Kazuyasu Nishikawa, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device includes: a substrate; a semiconductor element on the substrate; an interconnection on the substrate and electrically connected to the semiconductor element; a window frame member on the substrate, surrounding the semiconductor element, and in contact with the interconnection; and a sealing window bonded to the window frame member and encapsulating the semiconductor element. The window frame member is a low melting glass and has a sheet resistance of 10-10Ω/□.