The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Apr. 24, 2012
Applicants:

Jochen Zoellin, Stuttgart, DE;

Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;

Ulrike Scholz, Korntal-Muenchingen, DE;

Inventors:

Jochen Zoellin, Stuttgart, DE;

Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;

Ulrike Scholz, Korntal-Muenchingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81B 7/00 (2006.01); B81B 3/00 (2006.01); B81B 7/02 (2006.01); H01L 25/16 (2006.01); H04R 19/04 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/00 (2013.01); H01L 2224/32225 (2013.01); H01L 24/73 (2013.01); B81B 2207/015 (2013.01); B81B 7/0061 (2013.01); H01L 24/48 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/1433 (2013.01); B81B 7/02 (2013.01); H01L 2224/32145 (2013.01); H01L 24/32 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/1461 (2013.01); B81B 2201/0257 (2013.01); H01L 25/16 (2013.01); H04R 19/04 (2013.01); B81C 1/0023 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/18161 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A component includes at least one MEMS component and at least one additional semiconductor component in a common housing having at least one access opening. On the front side of the MEMS component, at least one diaphragm structure is provided, which spans a cavity on the backside of the MEMS component. The housing includes a carrier, on which the MEMS component is mounted. The MEMS component is mounted, using its front side, on the carrier, so that there is a standoff between the diaphragm structure and the carrier surface. The at least one additional semiconductor component is connected to the backside of the MEMS component, so that the MEMS component and the semiconductor component form a chip stack.


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