The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8816417 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 26, 2014

Filed:

Feb. 25, 2010
Applicants:

Sanghun Jeon, Yongin-si, KR;

Jong-hyuk Kang, Suwon-si, KR;

Heungkyu Park, Gumi-si, KR;

Jongwook Lee, Yongin-si, KR;

Inventors:

Sanghun Jeon, Yongin-si, KR;

Jong-Hyuk Kang, Suwon-si, KR;

Heungkyu Park, Gumi-si, KR;

Jongwook Lee, Yongin-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a back bias dielectric including a negative fixed charge, a gate electrode overlapping the back bias dielectric, a semiconductor layer disposed between the gate electrode and the back bias dielectric, and a gate dielectric disposed between the semiconductor layer and the gate electrode, wherein the negative fixed charge accumulates holes at a surface of the semiconductor layer facing the back bias dielectric.


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Jeon, Sanghun. (2014). Semiconductor devices and methods of forming semiconductor devices (U.S. Patent No. 8816417). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8816417

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