The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Jan. 30, 2012
Applicants:
Carlo Baterna Marbella, Singapore, SG;
Ganesh Vetrivel Periasamy, Singapore, SG;
Kok Kiat Koo, Singapore, SG;
Ai Min Tan, Singapore, SG;
Inventors:
Carlo Baterna Marbella, Singapore, SG;
Ganesh Vetrivel Periasamy, Singapore, SG;
Kok Kiat Koo, Singapore, SG;
Ai Min Tan, Singapore, SG;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 21/52 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
Abstract
In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.