The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Jul. 23, 2012
Applicants:

Takahito Suzuki, Tokyo, JP;

Tomohiko Sagimori, Tokyo, JP;

Hiroyuki Fujiwara, Tokyo, JP;

Tomoki Igari, Tokyo, JP;

Yusuke Nakai, Tokyo, JP;

Hironori Furuta, Tokyo, JP;

Mitsuhiko Ogihara, Tokyo, JP;

Inventors:

Takahito Suzuki, Tokyo, JP;

Tomohiko Sagimori, Tokyo, JP;

Hiroyuki Fujiwara, Tokyo, JP;

Tomoki Igari, Tokyo, JP;

Yusuke Nakai, Tokyo, JP;

Hironori Furuta, Tokyo, JP;

Mitsuhiko Ogihara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/08 (2010.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01); H01L 51/00 (2006.01); H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 51/0024 (2013.01); H01L 33/20 (2013.01); H01L 33/64 (2013.01);
Abstract

The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release.


Find Patent Forward Citations

Loading…