The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Oct. 07, 2010
Applicants:

Narutoshi Hoshino, Osaka, JP;

Yoshihiro Fujiwara, Osaka, JP;

Takashi Shibano, Osaka, JP;

Shinsuke Taka, Osaka, JP;

Inventors:

Narutoshi Hoshino, Osaka, JP;

Yoshihiro Fujiwara, Osaka, JP;

Takashi Shibano, Osaka, JP;

Shinsuke Taka, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/16 (2006.01); H01L 31/153 (2006.01); H03K 17/687 (2006.01); H03K 17/785 (2006.01); H01L 31/147 (2006.01); H03K 17/689 (2006.01);
U.S. Cl.
CPC ...
H01L 31/153 (2013.01); H03K 17/6871 (2013.01); H01L 2924/13091 (2013.01); H01L 2224/48137 (2013.01); H03K 17/785 (2013.01); H01L 31/147 (2013.01); H01L 2224/48247 (2013.01); H03K 17/689 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48257 (2013.01);
Abstract

A semiconductor relay includes two MOSFETs; a light emitting element; a light-receiving drive element for switching on and off the two MOSFETs; two output and two input conductor plates electrically connected to the two MOSFETs and the light emitting element, respectively; and an encapsulating resin encapsulating the two MOSFETs, the light emitting element, the light-receiving drive element, the two output and the two input conductor plates. The two output and two input conductor plates includes terminal portions which protrude outside the encapsulating resin and are mounted on a common printed circuit board. Further, the two output conductor plates includes mount portions on which the two MOSFETs are mounted or on which drain electrodes of the two MOSFETs are connected, and the mount portions are encapsulated by the encapsulating resin in such an orientation that a thickness direction of the mount portions intersects that of the printed circuit board.


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