The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Mar. 31, 2009
Applicants:

Kiyoshi Ogawa, Kizugawa, JP;

Mitsutoshi Setou, Hamamatsu, JP;

Inventors:

Kiyoshi Ogawa, Kizugawa, JP;

Mitsutoshi Setou, Hamamatsu, JP;

Assignee:

Shimadzu Corporation, Kyoto-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 49/04 (2006.01); G01N 1/06 (2006.01); H01J 49/00 (2006.01); G01N 1/28 (2006.01);
U.S. Cl.
CPC ...
H01J 49/0004 (2013.01); G01N 1/06 (2013.01); G01N 1/286 (2013.01); H01J 49/0459 (2013.01);
Abstract

A sample stage () on which a sample () is placed can be reciprocally moved along a guide () by a driving mechanism (). A cutter () which is moved in an X-Y plane by a driving mechanism () is placed at a sample cutting position (B). When the sample stage () is moved to the sample cutting position (B) and the cutter is driven with the height of the sample stage () being appropriately adjusted, an upper portion of the sampleis horizontally cut off with a predetermined thickness and a new sample analysis surface which was inside the sampleis exposed. Hence, by repeating a mass analysis for a predetermined measurement area at an analysis position (C) and a partial cutting of the sampleat the sample cutting position (B), it is possible to achieve a three-dimensional mass analysis imaging of the sample () without removing the sample () from the sample stage ().


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