The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Aug. 12, 2011
Applicants:

Choong-ho Lee, Yongin, KR;

Jung-min Lee, Yongin, KR;

Kie-hyun Nam, Yongin, KR;

Inventors:

Choong-Ho Lee, Yongin, KR;

Jung-Min Lee, Yongin, KR;

Kie-Hyun Nam, Yongin, KR;

Assignee:

Samsung Display Co., Ltd., Giheung-Gu, Yongin, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing an encapsulation substrate for an organic light emitting diode display, includes fabricating a composite panel by forming an uncured carbon fiber resin portion having a plate shape and including an upper surface and a lower surface and forming an uncured insulating resin portion arranged to surround edges of the carbon fiber resin portion, the uncured insulating resin portion being perforated by a plurality of penetration holes, inserting a plurality of conductive components into corresponding ones of the plurality of penetration holes, covering upper and lower surfaces of the composite panel with metal films and bonding the metal films to the composite panel while simultaneously curing the carbon fiber resin and the insulating resin portion by applying heat and pressure to the composite panel. Therefore, fabrication processes of the encapsulation substrate are simple, and fabrication costs are reduced.


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