The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Jul. 08, 2010
Hironao Okayama, Kudamatsu, JP;
Teppei Kurokawa, Kudamatsu, JP;
Kouji Nanbu, Kudamatsu, JP;
Yoshihiko Isobe, Kudamatsu, JP;
Takashi Koshiro, Kudamatsu, JP;
Akira Kaneko, Kudamatsu, JP;
Hajime Ota, Osaka, JP;
Kotaro Ohki, Osaka, JP;
Takashi Yamaguchi, Osaka, JP;
Kazuya Ohmastu, Osaka, JP;
Hironao Okayama, Kudamatsu, JP;
Teppei Kurokawa, Kudamatsu, JP;
Kouji Nanbu, Kudamatsu, JP;
Yoshihiko Isobe, Kudamatsu, JP;
Takashi Koshiro, Kudamatsu, JP;
Akira Kaneko, Kudamatsu, JP;
Hajime Ota, Osaka, JP;
Kotaro Ohki, Osaka, JP;
Takashi Yamaguchi, Osaka, JP;
Kazuya Ohmastu, Osaka, JP;
Toyo Kohan Co., Ltd., Tokyo, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.