The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Jun. 20, 2011
Applicant:

Osamu Miyagawa, Yokkaichi, JP;

Inventor:

Osamu Miyagawa, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/3213 (2006.01); H01L 27/105 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32137 (2013.01); H01L 27/105 (2013.01); H01L 27/115 (2013.01); H01L 27/11526 (2013.01); H01L 27/11529 (2013.01); H01L 27/11543 (2013.01);
Abstract

A method of manufacturing a semiconductor device including forming a mask layer on a polycrystalline silicon film formed on a semiconductor substrate via an insulating film; forming a dense pattern and a sparse pattern on the mask layer to form a mask; etching the polycrystalline silicon film with the mask by controlling a temperature of the semiconductor substrate placed in an etching chamber at 50 degrees Celsius or higher, supplying an etching gas composed of a hydrogen bromide containing gas and a fluoromethane based gas into the chamber, and generating plasma in the chamber.


Find Patent Forward Citations

Miyagawa, Osamu. (2014). Method of manufacturing semiconductor device (U.S. Patent No. 8815726). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8815726

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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