The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Oct. 18, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are methods of manufacturing semiconductor devices. The method of manufacturing the semiconductor device may include forming a transistor on a substrate, the transistor having first and second doped regions, forming an interlayer dielectric on the substrate, forming a contact hole exposing the first doped region of the transistor, forming a spacer disposed on an inner sidewall of the contact hole, and filling the contact hole provided with the spacer with a conductive layer to form a contact plug.
Quick Actions:
Park, Jongchul. (2014). Methods of manufacturing semiconductor devices having spacers disposed on an inner sidewall of a contact hole formed in a layer of the semiconductor devices, and a contact plug disposed therein (U.S. Patent No. 8815687). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8815687
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile