The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
May. 18, 2012
Applicant:
Hirotaka Ohno, Miyoshi, JP;
Inventor:
Hirotaka Ohno, Miyoshi, JP;
Assignee:
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01R 9/00 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/047 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/04 (2013.01); H01L 23/047 (2013.01); H01L 23/4334 (2013.01); H01L 23/49517 (2013.01); H01L 24/32 (2013.01); H01L 23/3142 (2013.01); H01L 24/33 (2013.01);
Abstract
A semiconductor device is formed by molding using a resin with a semiconductor element and one or two heat dissipating plates contained therein, said one or two heat dissipating plates being disposed to face one surface or both the surfaces of the semiconductor element. An intermediate layer is formed by spraying a metal powder to the semiconductor element and to one of or both of the heat dissipating plates using a cold spray method, and the semiconductor element and the heat dissipating plate are bonded together using a solder with the intermediate layer therebetween.