The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Aug. 05, 2009
Applicants:

Johannes Bühler, Uster, CH;

Felix Mayer, Stäfa, CH;

Matthias Streiff, Zürich, CH;

René Hummel, Baar, CH;

Robert Sunier, Zürich, CH;

Inventors:

Johannes Bühler, Uster, CH;

Felix Mayer, Stäfa, CH;

Matthias Streiff, Zürich, CH;

René Hummel, Baar, CH;

Robert Sunier, Zürich, CH;

Assignee:

Sensirion AG, Stafa, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/02 (2006.01); B81C 1/00 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0073 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0353 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0315 (2013.01); B81C 1/00087 (2013.01); B81C 2201/0143 (2013.01); B81C 1/00801 (2013.01);
Abstract

A differential pressure sensor comprises a membrane arranged over a cavity on a semiconductor substrate. A lid layer is arranged at the top side of the device and comprises an access opening for providing access to the top side of the membrane. A channel extends laterally from the cavity and intersects with a bore. The bore is formed by laser drilling from the bottom side of the substrate and provides access to the bottom side of the membrane. The bore extends all through the substrate and optionally into the lid layer.


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