The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Aug. 21, 2012
Applicants:

Ji-young Jeong, Uiwang-si, KR;

Jin-young Lee, Uiwang-si, KR;

Jong-hwa Lee, Uiwang-si, KR;

Hyun-yong Cho, Uiwang-si, KR;

Sang-soo Kim, Uiwang-si, KR;

Eun-kyung Yoon, Uiwang-si, KR;

Jun-ho Lee, Uiwang-si, KR;

Myoung-hwan Cha, Uiwang-si, KR;

Eun-ha Hwang, Uiwang-si, KR;

Inventors:

Ji-Young Jeong, Uiwang-si, KR;

Jin-Young Lee, Uiwang-si, KR;

Jong-Hwa Lee, Uiwang-si, KR;

Hyun-Yong Cho, Uiwang-si, KR;

Sang-Soo Kim, Uiwang-si, KR;

Eun-Kyung Yoon, Uiwang-si, KR;

Jun-Ho Lee, Uiwang-si, KR;

Myoung-Hwan Cha, Uiwang-si, KR;

Eun-Ha Hwang, Uiwang-si, KR;

Assignee:

Cheil Industries Inc., Gumi-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0236 (2013.01);
Abstract

Disclosed are a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1 and a repeating unit represented by the following Chemical Formula 2, and having a thermally polymerizable functional group at at least one of the terminal end; (B) a dissolution controlling agent including a novolac resin including a repeating unit represented by the following Chemical Formula 4; (C) a photosensitive diazoquinone compound; (D) a silane compound; (E) an acid generator; and (F) a solvent, a photosensitive resin film prepared using the same, and a semiconductor device including the photosensitive resin film.


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