The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Jul. 11, 2008
Applicants:
Yoshihiro Kato, Tokyo, JP;
Takeshi Nobukuni, Tokyo, JP;
Masayoshi Ueno, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); B32B 15/06 (2006.01); B32B 15/08 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); B32B 27/06 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08L 33/04 (2006.01); C08L 33/14 (2006.01); C08L 83/00 (2006.01); C08L 83/04 (2006.01); C08L 83/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.