The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Jul. 15, 2004
Tetsuro Sato, Ageo, JP;
Toshifumi Matsushima, Ageo, JP;
Tetsuro Sato, Ageo, JP;
Toshifumi Matsushima, Ageo, JP;
Mitsu Minning & Smelting Co., Ltd., Tokyo, JP;
Abstract
The object of the present invention is to provide a copper foil with an ultra thin resin layer for a printed wiring board without roughening treatment. In order to achieve the object, there is adopted a copper foil with an ultra thin adhesive layer for a printed wiring boardor the like, which is a copper foil provided with an ultra thin primer resin layer for securing good laminating adhesiveness with a resin base material on one side of a copper foilwithout roughening treatment, characterized in that a silane coupling agent layeris formed on a surface of the copper foil without the roughening treatment having a surface roughness (Rz) of 2 μm or below, and an ultra thin primer resin layerhaving a converted thickness of 1 to 5 μm is formed on the silane coupling agent layer