The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8815339 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 26, 2014

Filed:

Dec. 28, 2007
Applicants:

Bok Ryul Yoo, Seoul, KR;

Joon Soo Han, Seongnam-si, KR;

Weon Cheol Lim, Seoul, KR;

Yong Su Jung, Seoul, KR;

Inventors:

Bok Ryul Yoo, Seoul, KR;

Joon Soo Han, Seongnam-si, KR;

Weon Cheol Lim, Seoul, KR;

Yong Su Jung, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 7/00 (2006.01); C09D 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed herein are a surface modifier for metal oxide particles and a method of modifying the surface of metal oxide particles using the same. The surface modifier consists either of an alkylsilanepolyol containing a cyclic alkyl group capable of imparting steric hindrance or of a mixture of said alkylsilanepolyol with alkylalkoxysilane, and the method of modifying the surface of metal oxide particles comprises coating the surface modifier on the hydrophilic surface of the metal oxide particles through chemical bonding so as to impart hydrophobicity or amphiphilicity (hydrophilicity and hydrophobicity) and reactivity to the surface of the metal oxide particles. Through the use of alkylsilane triol having a specific chemical structure, surface-modified metal particles having uniform particle size distribution can be provided not only by inhibiting the condensation and agglomeration of the surface modifier itself during a high-temperature condensation reaction for inducing the chemical bonding between metal oxide and the modifier, but also by stabilizing silicon-hydroxyl (Si—OH) bonds.


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