The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2014

Filed:

Sep. 21, 2011
Applicants:

Matthew C. Everhart, Fairborn, OH (US);

David E. Havens, Bellbrook, OH (US);

Joel James Everhart, Xenia, OH (US);

Randy Rex Kysar, Derby, KS (US);

Carl Ray Fiegenbaum, Rose Hill, KS (US);

Jeffrey W. Priest, Rose Hill, KS (US);

Kevin John Ford, Winterville, NC (US);

Delbert Leon Strelow, Wichita, KS (US);

Inventors:

Matthew C. Everhart, Fairborn, OH (US);

David E. Havens, Bellbrook, OH (US);

Joel James Everhart, Xenia, OH (US);

Randy Rex Kysar, Derby, KS (US);

Carl Ray Fiegenbaum, Rose Hill, KS (US);

Jeffrey W. Priest, Rose Hill, KS (US);

Kevin John Ford, Winterville, NC (US);

Delbert Leon Strelow, Wichita, KS (US);

Assignee:

Spirit AeroSystems, Inc., Wichita, KS (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus for fabricating a composite part with a shape memory polymer (SMP) apparatus usable as both a rigid tool and as a bladder. The SMP apparatus may be heated until malleable, shaped, and then cooled in a desired rigid tool configuration. The composite material may be applied onto the SMP apparatus and then placed into a rigid external mold and heated to composite cure temperatures at which the SMP apparatus is malleable. In some embodiments, an impermeable sheet of material may also be placed over portions of the composite material to compress it against the SMP apparatus. A pressure differential may be induced which urges the SMP apparatus to compress the composite material against the rigid external mold. When the composite material is cured, the pressure differential may be equalized and/or reversed and the malleable SMP apparatus may be removed from within the composite part.


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