The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Jan. 27, 2011
Nobukazu Hosokai, Nagaoka, JP;
Isamu Oguro, Nagaoka, JP;
Jun Watanabe, Tokyo, JP;
Tetsujiro Tada, Tokyo, JP;
Nobukazu Hosokai, Nagaoka, JP;
Isamu Oguro, Nagaoka, JP;
Jun Watanabe, Tokyo, JP;
Tetsujiro Tada, Tokyo, JP;
Sanshin Co., Ltd., Nagaoka-Shi, JP;
Nihon Micro Coating Co., Ltd., Tokyo, JP;
Abstract
A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.