The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Dec. 22, 2010
Yoshiyuki Murata, Okazaki, JP;
Tetsuo Hayashida, Toyota, JP;
Yoshiyuki Murata, Okazaki, JP;
Tetsuo Hayashida, Toyota, JP;
Toyota Boshoku Kabushiki Kaisha, Aichi-Ken, JP;
Abstract
A mold assembly that forms an expansion molded body by expanding foam raw material inside a cavity, includes a first die, a second die that closes together with the first die, wherein a sealed cavity is formed between the first die and the second die when the first die and the second die are closed, and a sealing member that is provided on at least one of the first die or the second die and seals the cavity, wherein at least one of a first space that is on a side of the sealing member that faces the cavity and leads to the cavity, or a second space that is formed inside the sealing member and leads to the cavity, is formed when the first die and the second die are closed.