The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Apr. 12, 2011
Jeong-beom Ihn, Bellevue, WA (US);
Jonathan Henry Gosse, Issaquah, WA (US);
Kay Y. Blohowiak, Issaquah, WA (US);
William B. H. Grace, Seattle, WA (US);
Jeong-Beom Ihn, Bellevue, WA (US);
Jonathan Henry Gosse, Issaquah, WA (US);
Kay Y. Blohowiak, Issaquah, WA (US);
William B. H. Grace, Seattle, WA (US);
The Boeing Company, Chicago, IL (US);
Abstract
The disclosure provides in one embodiment a system for monitoring adhesive integrity within a cured bondline of a bonded structural assembly. The system comprises a bonded structural assembly having a cured bondline. The cured bondline comprises an adhesive layer, a scrim ply layer integrated with the adhesive layer, and an electrical sensor network integrated with the scrim ply layer. The system further comprises an electrical power source for providing electrical power to the electrical sensor network. The system further comprises a digital data communications network for retrieving and processing data from the electrical sensor network. The electrical sensor network monitors adhesive integrity on demand by interpreting changes in local dynamic responses and electromechanical properties directly measured within the cured bondline.