The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Nov. 24, 2011
Applicants:

Thomas Gottwald, Dunningen-Seedorf, DE;

Christian Rossle, St. Georgen, DE;

Inventors:

Thomas Gottwald, Dunningen-Seedorf, DE;

Christian Rossle, St. Georgen, DE;

Assignee:

Schweizer Electronic AG, Schramberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 3/30 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20427 (2013.01); H01L 24/24 (2013.01); H01L 2924/01074 (2013.01); H01L 2224/18 (2013.01); H05K 3/30 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01327 (2013.01); H05K 1/183 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/92144 (2013.01); H05K 2201/066 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01023 (2013.01); H01L 2224/73267 (2013.01); H01L 24/82 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0102 (2013.01); H01L 23/5389 (2013.01);
Abstract

An electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides and with at least one electronic component arranged in a cutout of the first layer, wherein the first layer is covered in each case with an electrically insulating, thermally conductive layer and a further layer composed of electrically conductive material is provided in each case on the thermally conductive layer, the further layer being coated in each case with a covering layer composed of electrically conductive material, and furthermore having plated-through boles composed of the material of the covering layer, which extend through the electrically insulating, thermally conductive layer covering the electronic component and the further layer composed of electrically and thermally conductive material for the purpose of making contact with the electronic component.


Find Patent Forward Citations

Loading…