The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Feb. 19, 2013
Applicant:

Sae Magnetics (H.k) Ltd., Hong Kong, CN;

Inventors:

Li ping Peng, GuangDong, CN;

Shen kuang Sidney Chou, Hong Kong, CN;

Chi hung Yuen, Hong Kong, CN;

Yan bin Wang, GuangDong, CN;

Lu Xiao, GuangDong, CN;

Assignee:

SAE Magnetics (H.K.) Ltd., Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/60 (2006.01); G11B 5/127 (2006.01);
U.S. Cl.
CPC ...
G11B 5/127 (2013.01);
Abstract

A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.


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