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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8810043 B1

PDFFull Text
Date of Patent:
Aug. 19, 2014

Filed:

Aug. 01, 2011

Semiconductor device

Applicants:

Takao Nishimura, Kawasaki, JP;

Yoshikazu Kumagaya, Kawasaki, JP;

Akira Takashima, Kawasaki, JP;

Kouichi Nakamura, Kawasaki, JP;

Kazuyuki Aiba, Kawasaki, JP;

Inventors:

Takao Nishimura, Kawasaki, JP;

Yoshikazu Kumagaya, Kawasaki, JP;

Akira Takashima, Kawasaki, JP;

Kouichi Nakamura, Kawasaki, JP;

Kazuyuki Aiba, Kawasaki, JP;

Assignee:

Fujitsu Semiconductor Limited, Yokohama, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Meiya Li

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/32145 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/14 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/48465 (2013.01); H01L 24/81 (2013.01); H01L 2924/01046 (2013.01); H01L 24/13 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01074 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/13027 (2013.01); H01L 21/563 (2013.01); H01L 2224/13155 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/1134 (2013.01); H01L 2225/06558 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/81193 (2013.01); H01L 2924/30107 (2013.01); H01L 24/48 (2013.01); H01L 2224/13099 (2013.01); H01L 2924/014 (2013.01); H01L 2924/09701 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/01082 (2013.01); H01L 23/49833 (2013.01); H01L 25/0657 (2013.01); H01L 2224/1411 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/10329 (2013.01); H01L 24/17 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/15311 (2013.01); H01L 23/49811 (2013.01); H01L 2224/17107 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/0105 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/19042 (2013.01); H01L 2224/81194 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01033 (2013.01);
Abstract

A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

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