The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Dec. 13, 2011
Applicants:

Yuichi Niimura, Osaka, JP;

Hideo Nishikawa, Osaka, JP;

Fumihito Kato, Osaka, JP;

Inventors:

Yuichi Niimura, Osaka, JP;

Hideo Nishikawa, Osaka, JP;

Fumihito Kato, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/113 (2006.01); B81B 3/00 (2006.01); H01L 29/84 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0086 (2013.01); H01L 29/84 (2013.01); G01L 9/00 (2013.01);
Abstract

A semiconductor pressure sensor includes n-type semiconductor regions, which are formed in a diaphragm of a semiconductor substrate, piezoresistive elements, which are respectively formed in the n-type semiconductor regions, and conductive shielding thin film layers, which are respectively formed on the piezoresistive elements through an insulating thin film layer, and the piezoresistive elements form a Wheatstone bridge circuit. Further, the n-type semiconductor regions and the conductive shielding thin film layers are electrically connected to each other through contacts formed in the diaphragm.


Find Patent Forward Citations

Niimura, Yuichi. (2014). Semiconductor pressure sensor (U.S. Patent No. 8809975). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8809975

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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