The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Sep. 23, 2013
Applicant:

Megica Corporation, Hsin-Chu, TW;

Inventors:

Mou-Shiung Lin, Hsin-Chu, TW;

Jin-Yuan Lee, Hsin-Chu, TW;

Assignee:

Megit Acquisition Corp., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 31/119 (2006.01); H01L 29/00 (2006.01); H01L 23/34 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2006.01); H01L 25/065 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); H01L 2224/16245 (2013.01); H01L 23/645 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/10253 (2013.01); H01L 2224/16 (2013.01); H01L 25/16 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/19104 (2013.01); H01L 2224/45147 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15331 (2013.01); H01L 2224/73265 (2013.01); H01L 23/642 (2013.01); H01L 2224/48145 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/09701 (2013.01); H01L 24/45 (2013.01); H01L 2224/32225 (2013.01); H01L 25/0652 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/3011 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/01013 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/19041 (2013.01);
Abstract

Chip packages having power management integrated circuits are described. Power management integrated circuits can be combined with on-chip passive devices, and can provide voltage regulation, voltage conversion, dynamic voltage scaling, and battery management or charging. The on-chip passive devices can include inductors, capacitors, or resistors. Power management using a built-in voltage regulator or converter can provide for immediate adjustment of the voltage range to that which is needed. This improvement allows for easier control of electrical devices of different working voltages and decreases response time of electrical devices. Related fabrication techniques are described.


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