The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Jun. 03, 2010
Steffen Nowotny, Radabeul, DE;
Siegfried Scharek, Dresden, DE;
Frank Kublech, Dresden, DE;
Friedrich Kempe, Dresden, DE;
Steffen Nowotny, Radabeul, DE;
Siegfried Scharek, Dresden, DE;
Frank Kublech, Dresden, DE;
Friedrich Kempe, Dresden, DE;
Abstract
The invention relates to a modular system for overlay welding at inwardly disposed surfaces of workpieces using a laser beam. In this respect, a coating can be formed on inwardly disposed surfaces using a powdery welding material. It is the object of the invention to provide possibilities for the overlay welding or for the coating of inwardly disposed surfaces of workpieces with a variable immersion depth, increased flexibility and independence of direction in the processing. A feed for powdery welding material, a feed for protective gas and a feed for a coolant are present on a system in accordance with the invention. The system is formed with a coupling module for the laser beam, at least one beam guiding module for the laser beam and a processing module, which can be connected to one another. A collimated laser beam is directed via the coupling module through the beam guiding modules) onto an optical element focusing the laser beam on the surface of a workpiece to be processed. A nozzle having a discharge opening for the laser beam and the protective gas as well as a passage having a discharge opening for powdery welding material are present at the processing module.