The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Jun. 17, 2009
Tomoaki Yamashita, Oyama, JP;
Sumiko Nakajima, Ibaraki, JP;
Sadao Itou, Yuuki, JP;
Fumio Inoue, Tsukuba, JP;
Shigeharu Arike, Tochigi, JP;
Tomoaki Yamashita, Oyama, JP;
Sumiko Nakajima, Ibaraki, JP;
Sadao Itou, Yuuki, JP;
Fumio Inoue, Tsukuba, JP;
Shigeharu Arike, Tochigi, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.