The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Jun. 28, 2012
Applicant:
Masato Yoshida, Nagaokakyo, JP;
Inventor:
Masato Yoshida, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/28 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H05K 1/02 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H05K 3/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 2203/1316 (2013.01); H05K 3/284 (2013.01); H01L 24/97 (2013.01); H01L 23/5389 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/97 (2013.01); H05K 3/0052 (2013.01); H01L 2924/19105 (2013.01); H05K 2201/0715 (2013.01); H01L 2224/16225 (2013.01); H01L 23/3121 (2013.01); H01L 2224/48227 (2013.01); H01L 21/561 (2013.01); H01L 23/552 (2013.01); H01L 23/49822 (2013.01);
Abstract
A circuit module includes a substrate that has a substantially rectangular parallelepiped shape and includes a plurality of inner conductive layers, an electronic component disposed on a first main surface of the substrate, an insulating layer disposed on the first main surface of the substrate so as to cover the electronic component, a shielding layer disposed on a surface of the insulating layer, and a ground electrode connected to the plurality of inner conductive layers. At least two of the inner conductive layers are directly connected to the shielding layer.