The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Dec. 14, 2011
Erina Yamada, Komaki, JP;
Kazunaga Higo, Iida, JP;
Hironori Sato, Kasugai, JP;
NGK Spark Plug Co., Ltd., Nagoya, JP;
Abstract
A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may include a conductor layer, a solder resist layer laminated thereon, and a conductor post provided at least within the through-hole and that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder and includes a lower conductor post located within the through-hole and an upper conductor post located above the lower conductor post and projected outside the layer; the lower conductor post includes an external alloy layer disposed on an external side surface thereof; and the conductor post is brought into intimate contact with an internal side surface of the through-hole via the external alloy layer.