The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Jul. 02, 2012
Applicants:
Thomas A. Olden, Tucson, AZ (US);
Walter Wrigglesworth, Tucson, AZ (US);
Inventors:
Thomas A. Olden, Tucson, AZ (US);
Walter Wrigglesworth, Tucson, AZ (US);
Assignee:
Raytheon Company, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); H05K 3/4632 (2013.01); H05K 3/0014 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/092 (2013.01); H05K 1/0284 (2013.01); H05K 2201/09063 (2013.01); H05K 2203/302 (2013.01); H05K 3/465 (2013.01); H05K 2201/09018 (2013.01); H05K 1/05 (2013.01);
Abstract
A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.