The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Sep. 17, 2010
Applicants:
Deniz Sabuncuoglu Tezcan, Neerwinden, BE;
Yann Civale, Leuven, BE;
Bart Swinnen, Holsbeek, BE;
Eric Beyne, Leuven, BE;
Inventors:
Deniz Sabuncuoglu Tezcan, Neerwinden, BE;
Yann Civale, Leuven, BE;
Bart Swinnen, Holsbeek, BE;
Eric Beyne, Leuven, BE;
Assignee:
IMEC, Leuven, BE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating through substrate vias is disclosed. In one aspect, vias are etched from the backside of the substrate down to shallow trench isolation (STI) or the pre-metal dielectric stack (PMD). Extra contacts between metal 1 contact pads and the through-wafer vias are fabricated for realizing the contact between the through wafer vias and the back-end-of-line of the semiconductor chips.