The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Dec. 21, 2005
Applicants:

Karl Weidner, München, DE;

Robert Weinke, München, DE;

Inventors:

Karl Weidner, München, DE;

Robert Weinke, München, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/66 (2006.01); H01L 21/00 (2006.01); H01L 21/48 (2006.01); H01L 21/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/0445 (2013.01); H01L 22/00 (2013.01); H01L 21/4846 (2013.01);
Abstract

A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.


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