The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Sep. 29, 2010
Martin Ka Shing LI, Hong Kong, CN;
Max Leung, Hong Kong, CN;
Pompeo Umali, Hong Kong, CN;
NXP B.V., Eindhoven, NL;
Abstract
A method of dividing a two dimensional array of encapsulated integrated circuits into individual integrated circuit packages uses a first series of parallel cuts () extending fully through the leadframe () and encapsulation layer (), and defining rows of the array. The cuts terminate before the beginning and end of the rows such that the integrity of the array is maintained by edge portions () at the ends of the rows. After plating contact pads (), a second series of parallel cuts () is made extending fully through the leadframe () and encapsulation layer (). This separates the array into columns thereby providing singulation of packages between the edge portions ().