The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Aug. 30, 2012
Applicant:
Behnam Tabrizi, Harvard, MA (US);
Inventor:
Behnam Tabrizi, Harvard, MA (US);
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/14 (2006.01); H01L 23/055 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 2924/15165 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48235 (2013.01); H01L 2924/15153 (2013.01); H01L 2224/81894 (2013.01); H01L 24/16 (2013.01); H01L 2924/01031 (2013.01); H01L 23/10 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73257 (2013.01); H01L 2924/3011 (2013.01); H01L 24/48 (2013.01); H01L 2224/13144 (2013.01); H01L 2924/01027 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/484 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/01082 (2013.01); H01L 23/49827 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/014 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81205 (2013.01); H01L 23/66 (2013.01); H01L 24/81 (2013.01); H01L 2924/01014 (2013.01); H01L 2224/8383 (2013.01); H01L 2924/01074 (2013.01); H01L 24/73 (2013.01); H01L 24/12 (2013.01); H01L 23/147 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/32145 (2013.01); H01L 2924/19041 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01033 (2013.01); H01L 23/055 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/14 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01006 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/01015 (2013.01); H01L 25/165 (2013.01); H01L 2224/13099 (2013.01);
Abstract
A method of packaging a semiconductor device that incorporates the formation of cavities about electronic devices during the packaging process. In one example, the device package includes a first substrate having a first recess formed therein, a second substrate having a second recess formed therein, and an electronic device mounted in the first recess. The first and second substrates are joined together with the first and second recesses substantially overlying one another so as to form a cavity around the electronic device.