The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Nov. 27, 2009
Applicants:

Stefan Grötsch, Bad Abbach, DE;

Klaus Müller, Pettendorf, DE;

Inventors:

Stefan Grötsch, Bad Abbach, DE;

Klaus Müller, Pettendorf, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H05K 1/02 (2006.01); H01L 33/64 (2010.01); H05K 3/00 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2081 (2013.01); H05K 1/021 (2013.01); H01L 33/64 (2013.01); H05K 3/0061 (2013.01); H01L 33/005 (2013.01); H01L 25/0753 (2013.01); H05K 1/182 (2013.01); H05K 2203/0315 (2013.01); H01L 2224/48227 (2013.01); H05K 3/341 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A method for producing luminous means proposes providing a carrier serving as a heat sink, said carrier comprising a planar chip mounting region. The planar chip mounting region is structured for the purpose of producing a first partial region and at least one second partial region. In this case, the first partial region has a solder-repellent property after structuring. Afterward, a solder is applied to the planar chip mounting region, such that said solder wets the at least one second partial region. At least one optoelectronic body is fixed into the at least one second partial region with the solder at the carrier. Finally, contact-connections are formed for the purpose of feeding electrical energy to the optoelectronic luminous body.


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