The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Dec. 12, 2012
Applicant:
Intellectual Discovery Co., Ltd., Seoul, KR;
Inventors:
Meng Ee Lee, Bukit Mertajam, MY;
Seong Choon Lim, Bayan Lepas, MY;
Eng Chuan Ong, Bukit Mertajam, MY;
Assignee:
Intellectual Discovery Co., Ltd., Seoul, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/00 (2010.01); H01L 33/52 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/48227 (2013.01); H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 33/48 (2013.01); H01L 2224/73265 (2013.01); H01L 33/60 (2013.01);
Abstract
An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.