The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Dec. 28, 2012
Elite Material Co., Ltd., Tao-Yuan Hsien, TW;
Chen-Yu Hsieh, Taoyuan County, TW;
Yi-Fei Yu, Taoyuan County, TW;
Elite Material Co., Ltd., Tao-Yuan Hsien, TW;
Abstract
A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.