The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Oct. 27, 2011
Applicant:

Kuo-chuang Chiu, Hsinchu, TW;

Inventor:

Kuo-Chuang Chiu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 15/20 (2006.01); B32B 37/06 (2006.01); B32B 37/14 (2006.01); B32B 18/00 (2006.01); B32B 37/12 (2006.01); C08L 1/00 (2006.01); C08K 3/22 (2006.01); C04B 35/636 (2006.01); C04B 37/02 (2006.01); C04B 35/634 (2006.01); B82Y 30/00 (2011.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
C04B 37/028 (2013.01); C04B 2237/60 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5454 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/407 (2013.01); C04B 2237/72 (2013.01); C04B 35/6365 (2013.01); C04B 37/025 (2013.01); H01L 33/641 (2013.01); C04B 35/63416 (2013.01); C04B 2237/064 (2013.01); C04B 2237/708 (2013.01); C04B 2237/348 (2013.01); C04B 2237/06 (2013.01); C04B 2235/3281 (2013.01); C04B 2237/366 (2013.01); B82Y 30/00 (2013.01); C04B 2237/068 (2013.01); C04B 35/6342 (2013.01); C04B 2237/592 (2013.01); C04B 2237/343 (2013.01); C04B 2237/08 (2013.01);
Abstract

Disclosed is a bonding structure, including a heat dissipation substrate, a eutectic layer on the heat dissipation substrate, and a copper layer on the eutectic layer. The thermal dissipation substrate includes aluminum oxide, aluminum nitride, or zirconium oxide. The eutectic layer includes aluminum oxide, aluminum nitride, or zirconium oxide doped with zinc, tin, indium, or combinations thereof.


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